Magnetic thin film inductor design & fabrication Top view and
Top view and cross sectional view
Fabricating process
- Lower core (Fe-B-N) sputtering
- Lithography
- Insulation layer (Polyimide)
- Seed layer
- Lithography
- Cu coil electroplating
- Insulation layer
- Upper core
- Lithography
- Dry etching (RIE) for contact pad exposure